Site icon HU

Huawei to use SMIC to fab 7nm ICs this year

Huawei to use SMIC to fab 7nm ICs this year

Huawei to use SMIC to fab 7nm ICs this year


According to the latest information, Huawei is expected to fab 5G chips on a 7nm process at SMIC this year, reports the Nikkei. For your information, the chips will not be available on phones until next year. Last year, SMIC made a special chip for mining cryptocurrency for Bit using a 7nm process.

However, they have now developed a new technology called Extensive Design Technology Co-Optimization (DTCO) and high-density logic libraries. This allows them to fit 89 million transistors in each square millimeter (89MT/mm^2), which is similar to the technology used by TSMC and Intel. Because of this, SMIC’s N+1 process is a viable alternative to the 7nm technology for making chips this year.

The 7nm process Huawei is using is thought to be SMIC’s N+1 process characterised by TechInsights as having Fin Pitch (FP), Contacted Poly Pitch (CPP) and Metal 2 Pitch (M2P) sizes either larger or the same as TSMC’s N10 process.

Join Us On Telegram and Google News


Exit mobile version