Huawei published a patent for a chip stacking package and terminal equipment

Huawei has officially disclosed a patent for a chip stacking package and terminal equipment to solve the problem of high cost caused by the use of through-silicon via technology.

Huawei published a chip-related patent on April 5, with the publication number CN114287057A. The patent details show that this is a chip stacking package and terminal equipment, involving the field of semiconductor technology, which can solve the problem of high cost caused by the use of through-silicon via technology while ensuring the power supply demand.

The patent documents show that the chip stack package (01) includes:

A first chip (101) and a second chip (102) disposed between the first wiring structure (10) and the second wiring structure (20);

The active surface (S1) of the first chip (101) faces the active surface (S2) of the second chip (102);

The active surface (S1) of the first chip (101) includes a first overlapping area (A1) and a first non-overlapping area (C1), and the active surface (S2) of the second chip (102) includes a second overlapping area (C1) an overlapping area (A2) and a second non-overlapping area (C2);

The first overlapping area (A1) overlaps the second overlapping area (A2), and the first overlapping area (A1) and the second overlapping area (A2) are connected;

The first non-overlapping region (C1) is connected with the second wiring structure (20);

The second non-overlapping region (C2) is connected with the first wiring structure (10).