Huawei published patent for Detecting chip cracks

Huawei has published a patent for “a device for detecting chip cracks” on December 3, with the publication number CN113748495A. As per the details, the present invention is a device for detecting chip cracks, which can reduce the interference to the functional circuit while realizing the crack detection.

The device includes a functional circuit (110) and a split detection module (120) located around the functional circuit (110). Among them, the split detection module (120) includes a front-end device layer (121) and a layered structure (122) arranged on the front-end device layer (121). A wire (L) is formed in the layered structure (122).

One or more first capacitors (C1) are formed in the channel device layer (121). The first end of the wire (L) is used to connect the positive pole of the power supply, and the second end of the wire (L) is used to connect the negative pole of the power supply.

The first capacitor (C1) is connected in parallel between the first end of the wire (L) and the wire (L) Between the second ends, a detection interface is provided between the first end and the second end of the wire (L), and the detection interface is used to detect whether the chip is broken.

Huawei also recently published related patents on “chip package components”, which can enable chip package components to achieve better heat dissipation and reduce potential safety hazards.

Related: Huawei has a new patent for Detecting Autopilot System