Huawei News
Huawei’s new HarmonyOS certification released
According to the Huawei certification release, Huawei certified HarmonyOS application development senior engineer HCIP-HarmonyOS Application Developer V1.0 (Chinese version) released in China on May 30, 2022.
Based on the “Platform + Ecosystem” strategy and around the new ICT technology architecture of “cloud-pipe-device” collaboration, Huawei has built a certification system covering the ICT field, including ICT technology architecture and applications, cloud services and platforms.
According to the learning and advanced needs of ICT practitioners, Huawei certification is divided into three certification levels: engineer level, senior engineer level, and expert level.
Huawei certification covers all fields of ICT and conforms to the technological trend of ICT integration. It is committed to providing leading talent training systems and certification standards, cultivating new ICT talents in the digital age, and building a healthy ICT talent ecosystem.
HCIP-HarmonyOS Application Developer V1.0 is positioned to train and certify senior engineers with professional knowledge and skill levels in HarmonyOS application development scenarios.
Passing the HCIP-HarmonyOS Application Developer V1.0 certification will prove that you have systematically understood and mastered the introduction of system and application scenarios, the Ark development framework, distributed key technologies, service cards, application design introduction, one-time development and multi-terminal deployment, function development and engineering The debugging content has the ability of multi-functional development, debugging and release, and can be qualified for the position of senior engineer of HarmonyOS application development.
Product description
The list of Huawei certified HCIP-HarmonyOS Application Developer V1.0 products is as follows:
“HCIP-HarmonyOS Application Developer V1.0 Training Syllabus”
“HCIP-HarmonyOS Application Developer V1.0 Exam Syllabus”
“HCIP-HarmonyOS Application Developer V1.0 Syllabus”
“HCIP-HarmonyOS Application Developer V1.0 Training Materials”
“HCIP-HarmonyOS Application Developer V1.0 Student’s Book”
“HCIP-HarmonyOS Application Developer V1.0 Experiment Manual”
“HCIP-HarmonyOS Application Developer V1.0 Mock Test”
“HCIP-HarmonyOS Application Developer V1.0 Course Schedule”
“HCIP-HarmonyOS Application Developer V1.0 Release Manual”
“HCIP-HarmonyOS Application Developer V1.0 Equipment List”
“HCIP-HarmonyOS Application Developer V1.0 Experimental Environment Construction Guide”
“HCIP-HarmonyOS Application Developer V1.0 Online Course” (expected to be released in June 2022)
Training Instructions
Training materials
HCIP-HarmonyOS Application Developer V1.0 training materials include:
Introduction to system and application scenarios: HarmonyOS features, HarmonyOS Connect solutions, etc.
Ark development framework: Web-like development paradigm, declarative development paradigm, etc.
Application function design and development: distributed key technology development, service card development, AI function development, application design, one-time development, multi-terminal deployment, etc.
Engineering debugging: engineering management, application or service debugging, application or service testing, etc.
Lab Manual
HCIP-HarmonyOS Application Developer V1.0 Lab Manual contains:
Web-like Development Paradigm Advanced Component Experiment
Declarative Development Paradigm Advanced Component Experiment
Distributed text editing function development experiment
Gallery App Service Card Experiment
One-time development and multi-terminal deployment experiments
Device parameter voice broadcast function development experiment
Application Debugging Experiment
Comprehensive experiment: Xiaohong online class 2.0
training time
HCIP-HarmonyOS Application Developer V1.0 training duration is 5 days.
lab environment
Please refer to “HCIP-HarmonyOS Application Developer V1.0 Equipment List” and “HCIP-HarmonyOS Application Developer V1.0 Experimental Environment Construction Guide” in the product list for equipment preparation and experimental environment construction.
Instructor Empowerment and Certification
Exam Instructions
The HCIP-HarmonyOS Device Developer V1.0 certification exam will be officially released on May 30, 2022. The HCIP-HarmonyOS Device Developer V1.0 certification written exam appointment website :
https://e.huawei.com/cn/talent/#/ pearson-VUE-appointment.
release area
HCIP-HarmonyOS Device Developer V1.0 will be officially released to China on May 30, 2022.
Mainly for users who use Huawei products, partner engineers, internal engineers, college students, and ICT practitioners.
Huawei is getting ready to release a new super-thin phone called the Mate 70 Air. Some details about this phone have already been leaked online, and now a new picture has appeared showing what it looks like.
What the phone looks like
A promotional poster for the Huawei Mate 70 Air was leaked today. The phone looks similar to other phones in Huawei’s Mate 70 family, but it’s much thinner.
The back of the phone has a round camera area with Huawei’s XMAGE camera logo on it. The edges of the phone appear to be shiny and polished. The back cover has a textured surface, similar to another Huawei model called the Mate 70 Pro+.
What’s inside the phone
There isn’t much information available yet, but the Mate 70 Air might be a mid-priced phone. Early reports said it would have 12GB of memory and either 256GB or 512GB of storage space. However, newer information suggests it will actually have 16GB of memory.
The phone is expected to have a large 6.9-inch screen. It will also have a high-quality main camera.
Other features
Unlike Apple’s iPhone Air, the Huawei Mate 70 Air will have a slot for a physical SIM card. The phone will run on Huawei’s HarmonyOS 5.1 software. It will come in three colors: black, white, and gold.
Huawei is expected to launch this phone in November, around the same time as its Mate 80 series.
Tipster Digital Chat Station has confirmed that the Chinese tech giant Huawei will release new phones called the Mate 80 series in November. These new phones will have better designs, cameras, and speed.
The company is expected to compete with Apple’s new iPhone 17 phones. Huawei will make four different Mate 80 phones: the regular Mate 80, Mate 80 Pro, Mate 80 Pro+, and Mate 80 RS. Each phone will have different cameras. The regular Mate 80 will have a 50-megapixel camera.
The Pro version will have a bigger 50-megapixel camera. The Pro+ and RS models will have even bigger 50-megapixel cameras.
The Pro model might have a flat screen and face recognition. The Pro+ and RS models might have curved screens that bend more.
The best phone, the Mate 80 RS, might have a 6.9-inch screen with special technology.
This screen should be brighter, use less battery power, and last longer than normal phone screens. Huawei might also use strong titanium metal for the frame and special glass on the back. Inside the phones, there will be a new chip called the Kirin 9030. The battery might be bigger than 6000mAh and charge very fast – 100W with a wire and 80W without wires. The phones might work with 5G internet and satellite communication.
The phones will use Huawei’s own software called HarmonyOS. This might work better with other Huawei devices and have more AI features. Some people think these improvements will help Huawei compete better with Apple, especially in battery life, communication, and smart features.
A Chinese company called HiSilicon Semiconductor just changed who’s in charge. The old boss, Xu Zhijun, stepped down from his job as the legal representative and chairman. Now the company’s CEO, Gao Ji, is taking over these roles.
Xu has been working at Huawei since 1993 and still has other important jobs there – he’s a vice chairman and sometimes serves as the rotating chairman. Him leaving this position is probably just Huawei moving people around to different jobs within the company.
HiSilicon is completely owned by Huawei and makes computer chips. This change in leadership might mean Huawei is trying to make things work better.
HiSilicon started in October 2004 when Huawei took its computer chip design team and turned it into its own company. The main office is in Shenzhen, but they also have offices in Beijing, Shanghai, and other cities in China.