Huawei News
Huawei Equipment Backdoor Found in HiSilicon Chips
Russian security researcher Vladislav Yarmak posted detailed information about the backdoor program he found in Huawei Hisilicon chip on the technology blog platform Habr. He said that the backdoor program has been used by millions of smart devices around the world, such as security cameras, DVR (Digital Video Recorder), NVR (Network Video Recorder) and so on.
At this time, a firmware fix for this backdoor is not available because Yarmak has not reported the problem to Hisilicon-he does not believe Hisense will properly resolve this issue. In a detailed technical summary published earlier to Habr, Yarmak stated that the backdoor is actually a mashup of four old security holes/backdoors that were previously in March 2013, March 2017, July 2017, and 2017 Found in September and has been made public.
Yarmak declared- Obviously, for many years, Hisilicon was unwilling or unable to provide enough security fixes for the same backdoor, and the backdoor was intentionally implemented.
According to Yarmak, a series of devices can be sent on TCP port 9530 to devices using Hisilicon chips (these devices run Linux, the firmware vulnerable devices run the macGuarder or dvrHelper processes, and accept connections on TCP port 9530) Command to take advantage of the backdoor.
These commands will enable the Telnet service on the vulnerable device.
Leifeng.com has learned that Telnet is a member of the TCP / IP protocol family and a standard protocol and main method for Internet remote login services. It provides users with the ability to do remote host work on the local computer. Use the Telnet program on the end user’s computer to connect to the server. End users can enter commands in the Telnet program, and these commands run on the server as if they were entered directly on the server console.
Yarmak said that once the Telnet service is up and running, an attacker could log in using one of the six Telnet login credentials listed below and gain access to a Root account, which gives them complete access to the vulnerable device Control.
Check the complete process here.
Huawei Replied in the same concern, “The researcher did not explicitly state product models and equipment vendors but inferred that the vulnerability is introduced by HiSilicon chips merely based on that the products use HiSilicon chips and that the firmware obtains the Telnet login password from the /etc/password file and logs in to Telnet to get root shell” said Huawei.
Huawei is getting ready to release a new super-thin phone called the Mate 70 Air. Some details about this phone have already been leaked online, and now a new picture has appeared showing what it looks like.
What the phone looks like
A promotional poster for the Huawei Mate 70 Air was leaked today. The phone looks similar to other phones in Huawei’s Mate 70 family, but it’s much thinner.
The back of the phone has a round camera area with Huawei’s XMAGE camera logo on it. The edges of the phone appear to be shiny and polished. The back cover has a textured surface, similar to another Huawei model called the Mate 70 Pro+.
What’s inside the phone
There isn’t much information available yet, but the Mate 70 Air might be a mid-priced phone. Early reports said it would have 12GB of memory and either 256GB or 512GB of storage space. However, newer information suggests it will actually have 16GB of memory.
The phone is expected to have a large 6.9-inch screen. It will also have a high-quality main camera.
Other features
Unlike Apple’s iPhone Air, the Huawei Mate 70 Air will have a slot for a physical SIM card. The phone will run on Huawei’s HarmonyOS 5.1 software. It will come in three colors: black, white, and gold.
Huawei is expected to launch this phone in November, around the same time as its Mate 80 series.
Tipster Digital Chat Station has confirmed that the Chinese tech giant Huawei will release new phones called the Mate 80 series in November. These new phones will have better designs, cameras, and speed.
The company is expected to compete with Apple’s new iPhone 17 phones. Huawei will make four different Mate 80 phones: the regular Mate 80, Mate 80 Pro, Mate 80 Pro+, and Mate 80 RS. Each phone will have different cameras. The regular Mate 80 will have a 50-megapixel camera.
The Pro version will have a bigger 50-megapixel camera. The Pro+ and RS models will have even bigger 50-megapixel cameras.
The Pro model might have a flat screen and face recognition. The Pro+ and RS models might have curved screens that bend more.
The best phone, the Mate 80 RS, might have a 6.9-inch screen with special technology.
This screen should be brighter, use less battery power, and last longer than normal phone screens. Huawei might also use strong titanium metal for the frame and special glass on the back. Inside the phones, there will be a new chip called the Kirin 9030. The battery might be bigger than 6000mAh and charge very fast – 100W with a wire and 80W without wires. The phones might work with 5G internet and satellite communication.
The phones will use Huawei’s own software called HarmonyOS. This might work better with other Huawei devices and have more AI features. Some people think these improvements will help Huawei compete better with Apple, especially in battery life, communication, and smart features.
A Chinese company called HiSilicon Semiconductor just changed who’s in charge. The old boss, Xu Zhijun, stepped down from his job as the legal representative and chairman. Now the company’s CEO, Gao Ji, is taking over these roles.
Xu has been working at Huawei since 1993 and still has other important jobs there – he’s a vice chairman and sometimes serves as the rotating chairman. Him leaving this position is probably just Huawei moving people around to different jobs within the company.
HiSilicon is completely owned by Huawei and makes computer chips. This change in leadership might mean Huawei is trying to make things work better.
HiSilicon started in October 2004 when Huawei took its computer chip design team and turned it into its own company. The main office is in Shenzhen, but they also have offices in Beijing, Shanghai, and other cities in China.
