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Huawei published patent for Detecting chip cracks

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Detecting chip cracks - Huawei Patent

Huawei has published a patent for “a device for detecting chip cracks” on December 3, with the publication number CN113748495A. As per the details, the present invention is a device for detecting chip cracks, which can reduce the interference to the functional circuit while realizing the crack detection.

The device includes a functional circuit (110) and a split detection module (120) located around the functional circuit (110). Among them, the split detection module (120) includes a front-end device layer (121) and a layered structure (122) arranged on the front-end device layer (121). A wire (L) is formed in the layered structure (122).

One or more first capacitors (C1) are formed in the channel device layer (121). The first end of the wire (L) is used to connect the positive pole of the power supply, and the second end of the wire (L) is used to connect the negative pole of the power supply.

Huawei published patent for Detecting chip cracks

The first capacitor (C1) is connected in parallel between the first end of the wire (L) and the wire (L) Between the second ends, a detection interface is provided between the first end and the second end of the wire (L), and the detection interface is used to detect whether the chip is broken.

Huawei also recently published related patents on “chip package components”, which can enable chip package components to achieve better heat dissipation and reduce potential safety hazards.

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Related: Huawei has a new patent for Detecting Autopilot System

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Huawei Mate 70 Air shows up in a promotional photo

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Huawei Mate 70 Air

Huawei is getting ready to release a new super-thin phone called the Mate 70 Air. Some details about this phone have already been leaked online, and now a new picture has appeared showing what it looks like.

What the phone looks like

A promotional poster for the Huawei Mate 70 Air was leaked today. The phone looks similar to other phones in Huawei’s Mate 70 family, but it’s much thinner.

The back of the phone has a round camera area with Huawei’s XMAGE camera logo on it. The edges of the phone appear to be shiny and polished. The back cover has a textured surface, similar to another Huawei model called the Mate 70 Pro+.
What’s inside the phone

There isn’t much information available yet, but the Mate 70 Air might be a mid-priced phone. Early reports said it would have 12GB of memory and either 256GB or 512GB of storage space. However, newer information suggests it will actually have 16GB of memory.
The phone is expected to have a large 6.9-inch screen. It will also have a high-quality main camera.

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Unlike Apple’s iPhone Air, the Huawei Mate 70 Air will have a slot for a physical SIM card. The phone will run on Huawei’s HarmonyOS 5.1 software. It will come in three colors: black, white, and gold.
Huawei is expected to launch this phone in November, around the same time as its Mate 80 series.

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Huawei Mate 80 series latest Information

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Huawei Mate 80 series

Tipster Digital Chat Station has confirmed that the Chinese tech giant Huawei will release new phones called the Mate 80 series in November. These new phones will have better designs, cameras, and speed.

The company is expected to compete with Apple’s new iPhone 17 phones. Huawei will make four different Mate 80 phones: the regular Mate 80, Mate 80 Pro, Mate 80 Pro+, and Mate 80 RS. Each phone will have different cameras. The regular Mate 80 will have a 50-megapixel camera.

The Pro version will have a bigger 50-megapixel camera. The Pro+ and RS models will have even bigger 50-megapixel cameras.
The Pro model might have a flat screen and face recognition. The Pro+ and RS models might have curved screens that bend more.
The best phone, the Mate 80 RS, might have a 6.9-inch screen with special technology.

This screen should be brighter, use less battery power, and last longer than normal phone screens. Huawei might also use strong titanium metal for the frame and special glass on the back. Inside the phones, there will be a new chip called the Kirin 9030. The battery might be bigger than 6000mAh and charge very fast – 100W with a wire and 80W without wires. The phones might work with 5G internet and satellite communication.

The phones will use Huawei’s own software called HarmonyOS. This might work better with other Huawei devices and have more AI features. Some people think these improvements will help Huawei compete better with Apple, especially in battery life, communication, and smart features.

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Huawei’s Xu Zhijun steps down as chairman

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Huawei HiSilicon

A Chinese company called HiSilicon Semiconductor just changed who’s in charge. The old boss, Xu Zhijun, stepped down from his job as the legal representative and chairman. Now the company’s CEO, Gao Ji, is taking over these roles.

Xu has been working at Huawei since 1993 and still has other important jobs there – he’s a vice chairman and sometimes serves as the rotating chairman. Him leaving this position is probably just Huawei moving people around to different jobs within the company.
HiSilicon is completely owned by Huawei and makes computer chips. This change in leadership might mean Huawei is trying to make things work better.

HiSilicon started in October 2004 when Huawei took its computer chip design team and turned it into its own company. The main office is in Shenzhen, but they also have offices in Beijing, Shanghai, and other cities in China.

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