Huawei News
Huawei releases July 2022 security patch details
Huawei has recently shared information regarding the HarmonyOS 3 beta. Now, the Chinese tech giant also shared the security patch details for the month of July 2022.
In July 2022 EMUI security patch details, Huawei fixes 2 critical, 12 High levels, and 18 medium levels of CVEs while there are no low levels of CVEs.
This security update includes the CVE announced in the June 2022 Android security bulletin:
Critical: CVE-2022-20130, CVE-2022-20145
High: CVE-2021-39691, CVE-2022-20006, CVE-2022-20134, CVE-2022-20135, CVE-2022-20142, CVE-2022-20143, CVE-2022-20141, CVE-2021-4154, CVE-2022-25375, CVE-2022-24958, CVE-2022-25258, CVE-2022-20132
Medium: CVE-2021-39806, CVE-2022-20197, CVE-2022-20201, CVE-2022-20202, CVE-2021-35118, CVE-2021-20268, CVE-2021-20321, CVE-2021-35121, CVE-2021-3635, CVE-2021-3715, CVE-2021-3743, CVE-2021-3753, CVE-2021-38160, CVE-2022-0492, CVE-2022-20148, CVE-2022-20166, CVE-2022-26966, CVE-2021-35119
Low: none
Already included in previous updates:CVE-2021-39803, CVE-2022-20007, CVE-2022-20109, CVE-2022-20110, CVE-2020-11307, CVE-2021-30264, CVE-2020-11263, CVE-2021-1894, CVE-2021-30272, CVE-2021-30274, CVE-2021-30275, CVE-2021-30278, CVE-2021-30279, CVE-2021-30282
This security update includes the following HUAWEI patches:
CVE-2021-40016: Improper permission control vulnerability in the Bluetooth module
Severity: Medium
Affected versions: EMUI 10.1.0, EMUI 10.1.1, EMUI 11.0.0, EMUI 12.0.0, Magic UI 3.1.0, Magic UI 3.1.1, Magic UI 4.0.0
Impact: Successful exploitation of this vulnerability will affect confidentiality.
CVE-2021-46741: Vulnerability of defects being introduced in the design process in the basic framework and settings module
Severity: Medium
Affected versions: EMUI 12.0.0, EMUI 11.0.1
Impact: Successful exploitation of this vulnerability will affect integrity.
CVE-2021-40012: Vulnerability of pointers being incorrectly used during data transmission in the video framework
Severity: Medium
Affected versions: EMUI 12.0.0
Impact: Successful exploitation of this vulnerability may affect confidentiality.
CVE-2022-31751: Multi-thread competition for resources in the kernel emcom module
Severity: Critical
Affected versions: EMUI 10.0.0, EMUI 10.1.0, EMUI 10.1.1, EMUI 11.0.1, EMUI 12.0.0, Magic UI 3.0.0, Magic UI 3.1.0, Magic UI 3.1.1
Impact: Successful exploitation of this vulnerability can affect availability.
CVE-2021-40013: Improper permission control vulnerability in the Bluetooth module
Severity: Medium
Affected versions: EMUI 10.1.0, EMUI 10.1.1, EMUI 11.0.0, EMUI 12.0.0, Magic UI 3.1.0, Magic UI 3.1.1, Magic UI 4.0.0
Impact: Successful exploitation of this vulnerability will affect integrity.
CVE-2022-34737: Incorrect permission assignment vulnerability in the application security module
Severity: Medium
Affected versions: EMUI 10.1.0, EMUI 10.1.1, EMUI 11.0.0, EMUI 11.0.1, EMUI 12.0.0, Magic UI 3.1.0, Magic UI 3.1.1, Magic UI 4.0.0
Impact: Successful exploitation of this vulnerability will affect integrity and confidentiality.
CVE-2022-31755: Improper preservation of permissions vulnerability in the communications module
Severity: Medium
Affected versions: EMUI 11.0.1
Impact: Successful exploitation of this vulnerability can affect availability.
CVE-2022-34736: Null pointer vulnerability in the frame scheduling module
Severity: Medium
Affected versions: EMUI 12.0.0, EMUI 11.0.1
Impact: Successful exploitation of this vulnerability will affect availability.
CVE-2022-34735: Null pointer vulnerability in the frame scheduling module
Severity: Medium
Affected versions: EMUI 12.0.0, EMUI 11.0.1
Impact: Successful exploitation of this vulnerability will affect availability.
CVE-2022-34739: Addition overflow vulnerability in the fingerprint sensor module
Severity: High
Affected versions: EMUI 10.0.0, EMUI 10.1.0, EMUI 10.1.1, EMUI 11.0.0, EMUI 12.0.0, Magic UI 3.0.0, Magic UI 3.1.0, Magic UI 3.1.1, Magic UI 4.0.0
Impact: Successful exploitation of this vulnerability may cause the data of unknown addresses to be obtained from the address mapping.
CVE-2022-34742: Read/Write vulnerability in system components
Severity: High
Affected versions: EMUI 10.1.0, EMUI 10.1.1, EMUI 11.0.0, EMUI 12.0.0, Magic UI 3.1.0, Magic UI 3.1.1, Magic UI 4.0.0
Impact: Successful exploitation of this vulnerability will affect confidentiality.
CVE-2022-34740: Buffer overflow vulnerability in the NFC module
Severity: Medium
Affected versions: EMUI 12.0.0, EMUI 11.0.1, EMUI 11.0.0, Magic UI 4.0.0
Impact: Successful exploitation of this vulnerability may cause exceptions in NFC card registration, deletion, and activation.
CVE-2022-34741: Buffer overflow vulnerability in the NFC module
Severity: Medium
Affected versions: EMUI 12.0.0, EMUI 11.0.1, EMUI 11.0.0, Magic UI 4.0.0
Impact: Successful exploitation of this vulnerability may cause exceptions in NFC card registration, deletion, and activation.
CVE-2022-31762: Input verification vulnerability in the AMS module
Severity: Medium
Affected versions: EMUI 11.0.1
Impact: Successful exploitation of this vulnerability will cause unauthorized operations.
CVE-2022-34743: Out-of-bounds read vulnerability in the AT commands of the USB port
Severity: Medium
Affected versions: EMUI 10.1.0, EMUI 10.1.1, EMUI 11.0.0, EMUI 11.0.1, EMUI 12.0.0, Magic UI 3.1.0, Magic UI 3.1.1, Magic UI 4.0.0
Impact: Successful exploitation of this vulnerability may affect availability.
CVE-2022-34738: Permission control vulnerability in the SystemUI module
Severity: Medium
Affected versions: EMUI 10.0.0, EMUI 10.1.0, EMUI 10.1.1, EMUI 11.0.0, EMUI 11.0.1, EMUI 12.0.0, Magic UI 3.0.0, Magic UI 3.1.0, Magic UI 3.1.1, Magic UI 4.0.0
Impact: Successful exploitation of this vulnerability will cause the service running in the background being unable to be perceived by the user.
Huawei is getting ready to release a new super-thin phone called the Mate 70 Air. Some details about this phone have already been leaked online, and now a new picture has appeared showing what it looks like.
What the phone looks like
A promotional poster for the Huawei Mate 70 Air was leaked today. The phone looks similar to other phones in Huawei’s Mate 70 family, but it’s much thinner.
The back of the phone has a round camera area with Huawei’s XMAGE camera logo on it. The edges of the phone appear to be shiny and polished. The back cover has a textured surface, similar to another Huawei model called the Mate 70 Pro+.
What’s inside the phone
There isn’t much information available yet, but the Mate 70 Air might be a mid-priced phone. Early reports said it would have 12GB of memory and either 256GB or 512GB of storage space. However, newer information suggests it will actually have 16GB of memory.
The phone is expected to have a large 6.9-inch screen. It will also have a high-quality main camera.
Other features
Unlike Apple’s iPhone Air, the Huawei Mate 70 Air will have a slot for a physical SIM card. The phone will run on Huawei’s HarmonyOS 5.1 software. It will come in three colors: black, white, and gold.
Huawei is expected to launch this phone in November, around the same time as its Mate 80 series.
Tipster Digital Chat Station has confirmed that the Chinese tech giant Huawei will release new phones called the Mate 80 series in November. These new phones will have better designs, cameras, and speed.
The company is expected to compete with Apple’s new iPhone 17 phones. Huawei will make four different Mate 80 phones: the regular Mate 80, Mate 80 Pro, Mate 80 Pro+, and Mate 80 RS. Each phone will have different cameras. The regular Mate 80 will have a 50-megapixel camera.
The Pro version will have a bigger 50-megapixel camera. The Pro+ and RS models will have even bigger 50-megapixel cameras.
The Pro model might have a flat screen and face recognition. The Pro+ and RS models might have curved screens that bend more.
The best phone, the Mate 80 RS, might have a 6.9-inch screen with special technology.
This screen should be brighter, use less battery power, and last longer than normal phone screens. Huawei might also use strong titanium metal for the frame and special glass on the back. Inside the phones, there will be a new chip called the Kirin 9030. The battery might be bigger than 6000mAh and charge very fast – 100W with a wire and 80W without wires. The phones might work with 5G internet and satellite communication.
The phones will use Huawei’s own software called HarmonyOS. This might work better with other Huawei devices and have more AI features. Some people think these improvements will help Huawei compete better with Apple, especially in battery life, communication, and smart features.
A Chinese company called HiSilicon Semiconductor just changed who’s in charge. The old boss, Xu Zhijun, stepped down from his job as the legal representative and chairman. Now the company’s CEO, Gao Ji, is taking over these roles.
Xu has been working at Huawei since 1993 and still has other important jobs there – he’s a vice chairman and sometimes serves as the rotating chairman. Him leaving this position is probably just Huawei moving people around to different jobs within the company.
HiSilicon is completely owned by Huawei and makes computer chips. This change in leadership might mean Huawei is trying to make things work better.
HiSilicon started in October 2004 when Huawei took its computer chip design team and turned it into its own company. The main office is in Shenzhen, but they also have offices in Beijing, Shanghai, and other cities in China.