Huawei News
Open source Harmony OpenHarmony 3.2 Beta 1 released
OpenHarmony 3.2 Beta1 version has been officially released. The updated content shows that OpenHarmony 3.2 Beta1 has achieved enhancements in the basic capabilities of lightweight systems, standard system basic capabilities, standard system distributed capabilities, standard system application framework capabilities, and standard system application capabilities.
OpenHarmony 3.2 Beta1 Changelog:
Enhanced basic capabilities of lightweight systems
The lightweight LiteOS system and the Linux system IPC are unified, which builds and improves the inter-process communication capabilities, including distributed inter-process communication, and provides local and distributed inter-process communication capabilities for distributed services and apps.
Enhancement of basic capabilities of standard systems
Added support for compiling and building for Arm 64-bit system versions.
Graphics support secure screenshots and secure screen recording; support for embedding display capabilities in other application interfaces.
The window supports the ability to quickly switch the desktop and restore the application window, wake the screen from the window, keep the screen always on / adjust the screen brightness of the window, and secure the layer.
The Ark VM supports multi-instance debugging, as well as conditional breakpoints and watch expression capabilities.
Multi-mode input supports remote control, mouse, keyboard input device hot-plug monitoring capability.
Securely supports OpenHarmony’s cross-device same-account mutual trust authentication capability.
Enhanced distributed capabilities of standard systems
System service management supports group verification mechanism capability.
Standard System Application Framework Capability Enhancement
ArkUI supports the AbilityComponent component to embed the application interface (Ability) as a control in other applications to display; enhance the ability of column and sidebar components, and support the ability to automatically hide by dragging and dropping.
Package management supports the installation, uninstallation, and query of sandbox applications, and the unpacking tool supports Stage model capabilities.
Meta-capability support Stage model supports Worker mechanism, and DFX capabilities such as ANR and application main thread stuck detection are added.
Enhanced application capabilities of standard systems
The gallery supports basic dynamic effects, supports image editing and saving capabilities, and provides OEM custom development capabilities.
Global developers can download the complete code through Gitee and mirror sites:
https://gitee.com/openharmony
OpenHarmony 3.2 Beta1 release notes：
https://gitee.com/openharmony/docs/blob/master/zh-cn/release-notes/OpenHarmony-v3.2-beta1.md
Huawei is getting ready to release a new super-thin phone called the Mate 70 Air. Some details about this phone have already been leaked online, and now a new picture has appeared showing what it looks like.
What the phone looks like
A promotional poster for the Huawei Mate 70 Air was leaked today. The phone looks similar to other phones in Huawei’s Mate 70 family, but it’s much thinner.
The back of the phone has a round camera area with Huawei’s XMAGE camera logo on it. The edges of the phone appear to be shiny and polished. The back cover has a textured surface, similar to another Huawei model called the Mate 70 Pro+.
What’s inside the phone
There isn’t much information available yet, but the Mate 70 Air might be a mid-priced phone. Early reports said it would have 12GB of memory and either 256GB or 512GB of storage space. However, newer information suggests it will actually have 16GB of memory.
The phone is expected to have a large 6.9-inch screen. It will also have a high-quality main camera.
Other features
Unlike Apple’s iPhone Air, the Huawei Mate 70 Air will have a slot for a physical SIM card. The phone will run on Huawei’s HarmonyOS 5.1 software. It will come in three colors: black, white, and gold.
Huawei is expected to launch this phone in November, around the same time as its Mate 80 series.
Tipster Digital Chat Station has confirmed that the Chinese tech giant Huawei will release new phones called the Mate 80 series in November. These new phones will have better designs, cameras, and speed.
The company is expected to compete with Apple’s new iPhone 17 phones. Huawei will make four different Mate 80 phones: the regular Mate 80, Mate 80 Pro, Mate 80 Pro+, and Mate 80 RS. Each phone will have different cameras. The regular Mate 80 will have a 50-megapixel camera.
The Pro version will have a bigger 50-megapixel camera. The Pro+ and RS models will have even bigger 50-megapixel cameras.
The Pro model might have a flat screen and face recognition. The Pro+ and RS models might have curved screens that bend more.
The best phone, the Mate 80 RS, might have a 6.9-inch screen with special technology.
This screen should be brighter, use less battery power, and last longer than normal phone screens. Huawei might also use strong titanium metal for the frame and special glass on the back. Inside the phones, there will be a new chip called the Kirin 9030. The battery might be bigger than 6000mAh and charge very fast – 100W with a wire and 80W without wires. The phones might work with 5G internet and satellite communication.
The phones will use Huawei’s own software called HarmonyOS. This might work better with other Huawei devices and have more AI features. Some people think these improvements will help Huawei compete better with Apple, especially in battery life, communication, and smart features.
A Chinese company called HiSilicon Semiconductor just changed who’s in charge. The old boss, Xu Zhijun, stepped down from his job as the legal representative and chairman. Now the company’s CEO, Gao Ji, is taking over these roles.
Xu has been working at Huawei since 1993 and still has other important jobs there – he’s a vice chairman and sometimes serves as the rotating chairman. Him leaving this position is probably just Huawei moving people around to different jobs within the company.
HiSilicon is completely owned by Huawei and makes computer chips. This change in leadership might mean Huawei is trying to make things work better.
HiSilicon started in October 2004 when Huawei took its computer chip design team and turned it into its own company. The main office is in Shenzhen, but they also have offices in Beijing, Shanghai, and other cities in China.