Huawei News
openEuler 20.03 LTS: Huawei joins with four leading OS vendors
Huawei joins with four leading OS vendors, Kylinsoft, iSoft, Uniontech, and the Institute of Software Chinese Academy of Sciences (ISCAS), to announce the commercial editions powered by openEuler.
On March 27, 2020, the openEuler 20.03 LTS edition is officially released in the open-source community. This is the first LTS edition since the open-source community was opened.
openEuler LTS Signals Mass Commercial Readiness of the Open Source OS
Based on Huawei’s longstanding technical expertise and product know-how, the openEuler 20.03 LTS edition has demonstrated industry-leading stability and security.
- Multi-core high concurrency: The file cache management mechanism has been lock-free optimized, improving Nginx HTTP concurrency by 15%.
- Integrated KAE plug-in: Software/hardware collaboration drives the Kunpeng processor hardware accelerator, enabling the Kunpeng acceleration library to help improve performance by 10% to 100%.
- iSula lightweight container: Being lightweight, fast, easy-to-use, and flexible, it slashes startup time by 35%, and drives down memory resource consumption by 68%.
- openEuler community build of OpenJDK: It improves performance by 20% through optimization of memory management and compilation.
- A-Tune: It provides intelligent, scenario-specific auto-tuning to improve system tuning efficiency by 30%.
- Broad architecture support: Compatible with the architectures of processors such as Kunpeng and x86, the OS will support more processor architectures in the future.
Four OS Vendors Released Commercial Editions, Enriching the Computing Ecosystem
- Kylinsoft builds the Kylin Server OS based on openEuler kernels. It applies to multi-core heterogeneous computing scenarios and is especially good at processing mission-critical services and data loads.
- iSoft launches iSoft Server OS V5.1 for Kunpeng, the first commercial release based on openEuler. iSoft will continue to support the openEuler community and help build openEuler towards a global leading community.
- Uniontech presents deepinEuler V1.0. The Kunpeng-based OS supports all new features of the Kunpeng processor and delivers a compelling performance. With the continuous upgrade of deepinEuler and the improvement of the Kunpeng ecosystem, deepinEuler will see wider adoption in more scenarios.
- ISCAS has officially released the EulixOS Server 1.0. In the future, ISCAS will initiate an open-source software supply lightening program, enabling the openEuler community with even better quality and sustainability.
Huawei is getting ready to release a new super-thin phone called the Mate 70 Air. Some details about this phone have already been leaked online, and now a new picture has appeared showing what it looks like.
What the phone looks like
A promotional poster for the Huawei Mate 70 Air was leaked today. The phone looks similar to other phones in Huawei’s Mate 70 family, but it’s much thinner.
The back of the phone has a round camera area with Huawei’s XMAGE camera logo on it. The edges of the phone appear to be shiny and polished. The back cover has a textured surface, similar to another Huawei model called the Mate 70 Pro+.
What’s inside the phone
There isn’t much information available yet, but the Mate 70 Air might be a mid-priced phone. Early reports said it would have 12GB of memory and either 256GB or 512GB of storage space. However, newer information suggests it will actually have 16GB of memory.
The phone is expected to have a large 6.9-inch screen. It will also have a high-quality main camera.
Other features
Unlike Apple’s iPhone Air, the Huawei Mate 70 Air will have a slot for a physical SIM card. The phone will run on Huawei’s HarmonyOS 5.1 software. It will come in three colors: black, white, and gold.
Huawei is expected to launch this phone in November, around the same time as its Mate 80 series.
Tipster Digital Chat Station has confirmed that the Chinese tech giant Huawei will release new phones called the Mate 80 series in November. These new phones will have better designs, cameras, and speed.
The company is expected to compete with Apple’s new iPhone 17 phones. Huawei will make four different Mate 80 phones: the regular Mate 80, Mate 80 Pro, Mate 80 Pro+, and Mate 80 RS. Each phone will have different cameras. The regular Mate 80 will have a 50-megapixel camera.
The Pro version will have a bigger 50-megapixel camera. The Pro+ and RS models will have even bigger 50-megapixel cameras.
The Pro model might have a flat screen and face recognition. The Pro+ and RS models might have curved screens that bend more.
The best phone, the Mate 80 RS, might have a 6.9-inch screen with special technology.
This screen should be brighter, use less battery power, and last longer than normal phone screens. Huawei might also use strong titanium metal for the frame and special glass on the back. Inside the phones, there will be a new chip called the Kirin 9030. The battery might be bigger than 6000mAh and charge very fast – 100W with a wire and 80W without wires. The phones might work with 5G internet and satellite communication.
The phones will use Huawei’s own software called HarmonyOS. This might work better with other Huawei devices and have more AI features. Some people think these improvements will help Huawei compete better with Apple, especially in battery life, communication, and smart features.
A Chinese company called HiSilicon Semiconductor just changed who’s in charge. The old boss, Xu Zhijun, stepped down from his job as the legal representative and chairman. Now the company’s CEO, Gao Ji, is taking over these roles.
Xu has been working at Huawei since 1993 and still has other important jobs there – he’s a vice chairman and sometimes serves as the rotating chairman. Him leaving this position is probably just Huawei moving people around to different jobs within the company.
HiSilicon is completely owned by Huawei and makes computer chips. This change in leadership might mean Huawei is trying to make things work better.
HiSilicon started in October 2004 when Huawei took its computer chip design team and turned it into its own company. The main office is in Shenzhen, but they also have offices in Beijing, Shanghai, and other cities in China.