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Huawei: Package Level Systems are the future development trend of HPC

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Package Level Systems

At the ICEPT 2021 International Conference on Electronic Packaging Technology, Tonglong Zhang of Huawei delivered a keynote speech stating that package level systems are the future development trend of high-performance computing (HPC) and network switching systems.

There are currently three major development trends for HPC chips:

1. High data throughput for AI applications brings higher interconnect density requirements;
2. More chips are integrated in the package to improve computing power and bring super-large size Packaging requirements;
3. Optical data transmission between IC packages.

Under this trend, packaging-level system technology emerged at the historic moment, which is characterized by ultra-large-size packaging and ultra-wideband dual-mode interconnection, with higher interconnection density, higher data bandwidth, shorter interconnection distance, and lower interconnection distance. The energy consumption and cost of data transmission. Typical examples include TSMC’s InFO-SoW, NVIDIA’s ISSCC 2021 super-large package, and so on.

Package Level Systems

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Huawei Back at the Top: Leading the World’s IoT 500 List

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The 2024 (9th) World Internet of Things Top 500 Summit was held in Beijing yesterday, and the World Internet of Things Top 500 ranking list was announced, including the well-known Huawei, Qualcomm, Microsoft, SpaceX, China Aerospace Science and Industry, China Aerospace Science and Technology, IBM, Siemens, Intel, Samsung, etc., involving nearly 50 major economies in the world.

The top 500 list also includes more than 150 Chinese companies, including China Unicom, China Telecom, China Mobile, China Electronics, China Electronics Technology Group Corporation, China National Petroleum Corporation, State Grid Corporation of China, CRRC Corporation Limited, TSMC, MediaTek, Gree Electric Appliances, Haier Group, iFlytek, Origin Quantum, JD.com, Lenovo, Baidu, Alibaba, Tencent, Xiaomi, HiSilicon, Huawei, ZTE, DJI, and SMIC.

The total GDP of the companies on this year’s Fortune 500 list exceeds 30 trillion US dollars, accounting for half of the total size of the global IoT digital economy, and has become a major force in the innovative development of the world’s economy and society.

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Huawei P50 Pocket July 2024 security patch update

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Huawei P50 Pocket news

Huawei P50 Pocket smartphone users are now getting the July 2024 security patch update in the global market. The latest update is rolling out with the firmware version 14.2.0.145.

Huawei P50 Pocket July 2024 update

List of Changes
This update improves system security with security patches.

[Security]
Integrates security patches released in July 2024 for improved system security.

Huawei P50 Pocket Specifications:

Huawei P50 Pocket sports a 6.9-inch flexible external screen (21:9 screen ratio, 2790×1188 resolution, 120Hz refresh rate, P3 global color management), and the external screen size is 1 inch. Huawei P50 Pocket is equipped with a new generation of water drop hinges, and the flatness of the screen is improved by 28%. It is equipped with Snapdragon 888 4G chip, a built-in 4000mAh battery, and supports up to 10V / 4A Huawei super fast charge.

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Huawei HiSilicon All-Connect Conference will be held on September 9

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Huawei HiSilicon All-Connect Conference

The 2024 HiSilicon Full Connect Conference will be held in Shenzhen on September 9. This is also the first HiSilicon Full Connect Conference.

HiSilicon said that this conference, with the theme of “Using Innovation to Create a Better Future”, aims to create an open and shared industry platform, bringing together thought leaders, business elites, technical experts, partners and other industry colleagues to seek cooperation and win-win future together.

The official agenda showed that HiSilicon will hold a keynote speech from 10:00 to 12:00, and then hold a new product launch conference from 14:00 to 17:00.

The next day, there will also be the Star Summit, Audio and Video Summit, Hongmeng Summit, White Appliance Summit, and Channel Partner Conference.

Huawei HiSilicon All-Connect Conference

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