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Huawei HiSilicon Kirin History – SoCs based on ARM architecture
Huawei HiSilicon Kirin History – The Huawei’s HiSilicon develops SoCs based on ARM architecture. The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones and Huawei MediaPad 10 FHD7 tablets.
1. K3V2
2.K3V2E
3.Kirin 620
4. Kirin 650, 655, 658, 659
5. Kirin 710
6. Kirin 810
7. Kirin 910 and 910T
8. Kirin 920, 925 and 928
9. Kirin 930 and 935
10. Kirin 950 and 955
11. Kirin 960
12. Kirin 970
13. Kirin 980
14. Kirin 990 4G & 990 5G.
1. K3V2: The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
Availability – Q1 2012
Model Number – Hi3620
CPU – Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB, Cores 4
GPU – Vivante GC4000, 240 MHz (15.3GFlops)
Type – LPDDR2
Bandwidth (GB/s) – 7.2 (up to 8.5)
Bus width (bit) – 64-bit dual-channel
Wireless – Cellular- N/A , WLAN- N/A, PAN- N/A
2.K3V2E: The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
Availability – 2013
Model Number – K3V2E
CPU – Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB, Cores 4
GPU – Vivante GC4000, 240 MHz (15.3GFlops)
Type – LPDDR2
Bandwidth (GB/s) – 7.2 (up to 8.5)
Bus width (bit) – 64-bit dual-channel
Wireless – Cellular- N/A , WLAN- N/A, PAN- N/A
3.Kirin 620: Supports – USB 2.0 / 13 MP / 1080p video encode.
Availability – Q1 2015
Model Number – Kirin 620
CPU – Cortex-A53, Cores 4
GPU – Mali-450 MP4, 533 MHz (32GFlops)
Type – LPDDR3 ( MHz)
Bandwidth (GB/s) – 6.4
Bus width (bit) – 32-bit single-channel
Wireless – Cellular- Dual SIM LTE Cat.4 (150 Mbit/s) , WLAN- 802.11 b/g/n (Wifi Direct & Hotspot) Not Supporting DLNA / Miracast, PAN- Bluetooth v4.0, A2DP, EDR, LE.
4. Kirin 650, Kirin 655, Kirin 658, Kirin 659:
Availability – Kirin 650 Q2 2016, Kirin 655 Q4 2016, Kirin 658 Q2 2017, Kirin 659 Q3 2017.
Model Number – Kirin 650, Kirin 655, Kirin 658, Kirin 659
CPU – Cortex-A53, Cores 4+4
GPU – Mali-T830 MP2, 900 MHz (40.8GFlops)
Type – LPDDR3 (933 MHz)
Bus width (bit) – 64-bit dual-channel (2x32bit)
Wireless – Cellular- Dual SIM LTE Cat.6 (300 Mbit/s) , WLAN- 802.11 b/g/n, PAN- Bluetooth v4.1. Bluetooth v4.2 (Kirin 659).
5. Kirin 710:
Availability – Q3 2018
Model Number – Kirin 710
CPU – Cortex-A73, Cortex-A53, Cores 4+4
GPU – Mali-G51 MP4, 1000 MHz
Type – LPDDR3 (933 MHz)
Wireless – Cellular- Dual SIM LTE Cat.12 (600 Mbit/s) , WLAN- 802.11 b/g/n, PAN- Bluetooth v4.2.
6. Kirin 810: DaVinci NPU based on Tensor Arithmetic Unit
Availability – Q2 2019
Model Number – Kirin 810
CPU – Cortex-A76, Cortex-A55,DynamIQ, Cores 2+6
GPU – Mali-G52 MP6, 820 MHz
Type – LPDDR4X
Wireless – Cellular- Dual SIM LTE Cat.12 (600 Mbit/s) , WLAN- 802.11 b/g/n/ac, PAN- Bluetooth v5.0.
7. Kirin 910 and 910T
Availability – H1 2014
Model Number – Kirin 910 and 910T
CPU – Cortex-A9, Cores 4
GPU – Mali-450 MP4, 533 MHz (32GFlops), Kirin 910T
Type – LPDDR3
Wireless – Cellular- LTE Cat.4 , WLAN- N/A, PAN- N/A.
8. Kirin 920, 925 and 928
Availability – H2 2014, Q3 2014
Model Number – Kirin 920,Kirin 925 and Kirin 928
CPU – Cortex-A15,Cortex-A7 big.LITTLE, Cores 4+4
GPU – Mali-T628 MP4, 600 MHz (76.8GFlops)
Type – LPDDR3 (1600 MHz)
Wireless – Cellular- LTE Cat.6 (300 Mbit/s), WLAN- N/A, PAN- N/A.
9. Kirin 930 and 935
Availability – Q1 2015
Model Number – Kirin 930 and 935
CPU – Cortex-A53, Cortex-A53, Cores 4+4
GPU – Mali-T628 MP4, 600 MHz(76.8GFlops), Kirin 935 680 MHz (87GFlops)
Type – LPDDR3 (1600 MHz)
Wireless – Cellular- Dual SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s), WLAN- N/A, PAN- N/A.
10. Kirin 950 and Kirin 955
Availability -Kirin 950 Q4 2015, Kirin 955 Q2 2016
Model Number – Kirin 950 and 955
CPU – Cortex-A72, Cortex-A53 big.LITTLE, Cores 4+4
GPU – Mali-T880 MP4, 900 MHz (122.4GFlops)
Type – LPDDR4, LPDDR3 (3 GB) LPDDR4 (4 GB)
Wireless – Cellular- Dual SIM LTE Cat.6, WLAN- N/A, PAN- N/A.
11. Kirin 960
Availability – Q4 2016
Model Number – Kirin 960
CPU – Cortex-A73, Cortex-A53 big.LITTLE, Cores 4+4
GPU – Mali-G71 MP8, 1037 MHz (282GFlops)
Type – LPDDR4-1600
Wireless – Cellular- Dual SIM LTE Cat.12 LTE 4x CA, 4×4 MIMO, WLAN- 802.11a/b/g/n/ac Dual-Band, PAN- N/A.
12. Kirin 970
Availability – Q4 2017
Model Number – Kirin 970
CPU – Cortex-A73, Cortex-A53 big.LITTLE, Cores 4+4
GPU – Mali-G72 MP12, 746 MHz (330 GFlops)
Type – LPDDR4X-1866
Wireless – Cellular- Dual SIM LTE Cat.18 LTE 5x CA, No 4×4 MIMO, WLAN- 802.11a/b/g/n/ac Dual-Band, PAN- N/A.
13. Kirin 980
Availability – Q4 2018
Model Number – Kirin 980
CPU – Cortex-A76, Cortex-A55,DynamIQ, Cores (2+2)+4
GPU – Mali-G76 MP10, 720 MHz (489.6 GFlops)
Type – LPDDR4X-2133
Wireless – Cellular-Dual SIM LTE Cat.21 LTE 5x CA, No 4×4 MIMO, WLAN- 802.11a/b/g/n/ac Dual-Band (Wave 2), PAN- N/A.
14. Kirin 990 4G & 990 5G
Availability – Q4 2019
Model Number -Kirin 990 4G & 990 5G
CPU – Cortex-A76, Cortex-A55, DynamIQ, Cores (2+2)+4
GPU – Mali-G76 MP16 with Kirin Gaming+ 2.0, 600 MHz (~700GFLOPS)
Type – LPDDR4X-2133
Wireless – Cellular-Balong 765 & Balong 5000 (Sub-6-GHz only; NSA & SA), WLAN- 802.11a/b/g/n/ac Dual-Band (Wave 2), PAN- N/A.
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Huawei is getting ready to release a new super-thin phone called the Mate 70 Air. Some details about this phone have already been leaked online, and now a new picture has appeared showing what it looks like.
What the phone looks like
A promotional poster for the Huawei Mate 70 Air was leaked today. The phone looks similar to other phones in Huawei’s Mate 70 family, but it’s much thinner.
The back of the phone has a round camera area with Huawei’s XMAGE camera logo on it. The edges of the phone appear to be shiny and polished. The back cover has a textured surface, similar to another Huawei model called the Mate 70 Pro+.
What’s inside the phone
There isn’t much information available yet, but the Mate 70 Air might be a mid-priced phone. Early reports said it would have 12GB of memory and either 256GB or 512GB of storage space. However, newer information suggests it will actually have 16GB of memory.
The phone is expected to have a large 6.9-inch screen. It will also have a high-quality main camera.
Other features
Unlike Apple’s iPhone Air, the Huawei Mate 70 Air will have a slot for a physical SIM card. The phone will run on Huawei’s HarmonyOS 5.1 software. It will come in three colors: black, white, and gold.
Huawei is expected to launch this phone in November, around the same time as its Mate 80 series.
Tipster Digital Chat Station has confirmed that the Chinese tech giant Huawei will release new phones called the Mate 80 series in November. These new phones will have better designs, cameras, and speed.
The company is expected to compete with Apple’s new iPhone 17 phones. Huawei will make four different Mate 80 phones: the regular Mate 80, Mate 80 Pro, Mate 80 Pro+, and Mate 80 RS. Each phone will have different cameras. The regular Mate 80 will have a 50-megapixel camera.
The Pro version will have a bigger 50-megapixel camera. The Pro+ and RS models will have even bigger 50-megapixel cameras.
The Pro model might have a flat screen and face recognition. The Pro+ and RS models might have curved screens that bend more.
The best phone, the Mate 80 RS, might have a 6.9-inch screen with special technology.
This screen should be brighter, use less battery power, and last longer than normal phone screens. Huawei might also use strong titanium metal for the frame and special glass on the back. Inside the phones, there will be a new chip called the Kirin 9030. The battery might be bigger than 6000mAh and charge very fast – 100W with a wire and 80W without wires. The phones might work with 5G internet and satellite communication.
The phones will use Huawei’s own software called HarmonyOS. This might work better with other Huawei devices and have more AI features. Some people think these improvements will help Huawei compete better with Apple, especially in battery life, communication, and smart features.
A Chinese company called HiSilicon Semiconductor just changed who’s in charge. The old boss, Xu Zhijun, stepped down from his job as the legal representative and chairman. Now the company’s CEO, Gao Ji, is taking over these roles.
Xu has been working at Huawei since 1993 and still has other important jobs there – he’s a vice chairman and sometimes serves as the rotating chairman. Him leaving this position is probably just Huawei moving people around to different jobs within the company.
HiSilicon is completely owned by Huawei and makes computer chips. This change in leadership might mean Huawei is trying to make things work better.
HiSilicon started in October 2004 when Huawei took its computer chip design team and turned it into its own company. The main office is in Shenzhen, but they also have offices in Beijing, Shanghai, and other cities in China.
