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Huawei published a new patent for Chip Stacking Package

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Chip Stacking Package

According to the State Intellectual Property Office, Huawei published a patent for “chip stacking packaging structure, packaging method, and electronic equipment”, with the publication number CN114450786A.

As per the patent details, the application relates to the field of electronic technology and is used to solve the problem of how to reliably bond multiple secondary chip stacking units to the same main chip stacking unit.

The patent documents show that the chip-on-package structure includes:

  • A main chip stacking unit has a plurality of main pins on the first surface that are insulated and arranged at intervals.
  • The first bonding layer is arranged on the first surface; the first bonding layer includes a plurality of bonding components that are insulated and arranged at intervals.
  • Each of the plurality of bonding assemblies includes at least one bonding portion, any two bonding portions are insulated and disposed of, and any two bonding portions have the same cross-sectional area; the plurality of bonding assemblies are respectively connected to the plurality of main pin keys combine.
  • A plurality of secondary chip stacking units is arranged on the surface of the first bonding layer on the side away from the main chip stacking unit.

The sub-chip stacking unit has a plurality of micro-bumps that are insulated and spaced apart; each of the plurality of micro-bumps is bonded to one of the plurality of bonding components.

Huawei Chip Stacking Package patent Huawei Chip Stacking Package

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Huawei Petal Mail App will no longer be available for download

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Huawei Petal Mail App

According to the official information, the Huawei released the delisting announcement of its Petal Mail App. The full text of the announcement is as follows: [translated]

Thank you for your continued attention and support to the Huawei Petal Mail App. In order to better adapt to the changing needs of product experience, service content and local markets, we have made strategic adjustments to the Huawei Petal Mail App.

The Petal Mail App will officially switch to the Email App on December 31, 2024, and the Petal Mail App will no longer be available for download from the App Store. The Petal Mail App you have installed can be used normally. We apologize for the inconvenience. You can continue to view, send or receive emails in the pre-installed Email App on your Huawei phone or use a computer browser to open the Petal Mail official website ( https://www.petalmail.com ), and your emails and personal data will not be lost.

Huawei Petal Mail App

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Huawei Mate 70 lineup repair spare parts prices announced

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Huawei Mate 70 lineup

Huawei released the Mate 70 series of mobile phones, with a starting price of 5,499 yuan. At present, the prices of spare parts for the new Mate 70 series have been announced on Huawei’s official website.

Huawei Mate 70 lineup repair spare parts prices announced

Battery and motherboard

Mate 70

Battery — 199
12GB+256GB — 2499
12GB+512GB — 2899
12GB+1TB — 3599

Mate 70 Pro

Battery — 199
12GB+256GB — 2899
12GB+512GB — 3299
12GB+1TB — 3999

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Mate 70 Pro+

Battery — 299
16GB+512GB — 4399
16GB+1TB — 4899

Mate 70 RS

Battery — 299
16GB+512GB — 6499
16GB+1TB — 6999

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Huawei FreeBuds Pro 4 official announcement

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Huawei FreeBuds Pro 4

Huawei officially announced the new FreeBuds Pro 4 headphones. This is the first TWS headset equipped with HarmonyOS NEXT and will be officially launched at the Huawei Mate Brand Festival on November 26.

As can be seen from the poster, the headset adopts an in-ear design with black and gold color matching, and the overall shape is similar to the previous generation. With the support of the new system, FreeBuds Pro 4 is expected to bring more functional upgrades.

Huawei FreeBuds Pro 4

For reference, Huawei FreeBuds Pro 3 was released in September last year with an initial price of 1,499 yuan . It is equipped with the Kirin A2 chip that uses Polar code, supports Star Flash connection core technology and Bluetooth technology, and the new L2HC 3.0 protocol.

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