According to the recent report, Huawei HiSilicon ranked 1st in Q1 2020 China smartphone SOC ranking. In 2019, Huawei ordered $5.1 billion worth of chips from TSMC.
Huawei this year started supplying chips to companies other than Huawei. Previously, the company only provided chip products to Huawei, but during the recent ELEXCON 2019 electronics show in Shenzhen, Hisilicon released the first 4G communication chip targeted at the open market. Huawei’s motive for 2020 is totally different, this year Huawei going to be the part of every business including smart products, daily life products, robotics, etc.
The Huawei’s HiSilicon develops SoCs based on ARM architecture. The first well-known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones and Huawei MediaPad 10 FHD7 tablets.
Huawei HiSilicon Kirin History:
- K3V2
- K3V2E
- Kirin 620
- Kirin 650, 655, 658, 659
- Kirin 710
- Kirin 810
- Kirin 910 and 910T
- Kirin 920, 925 and 928
- Kirin 930 and 935
- Kirin 950 and 955
- Kirin 960
- Kirin 970
- Kirin 980
- Kirin 985 5G
- Kirin 990 4G & 990 5G.
